CMTI

Chip module test system

Description

The Tape Inspection and Electric Test System CMTI is used to perform a fully automatic optical and electric inspection of the flip device on 35 / super 35 mm tapes.

This system can be attached for in-line inspection to the Flip Chip Bonder FCM 10000 or can be operated as stand-alone systems for off-line quality control.

The new highlight of CMTI is the full position control of the chip placement with:

- High precision optical measurement of position and

  size

- Contamination of chip bottom surface

  (depending on glue type and contrast)

Optional a electrical test station can be integrated for ATR and functional test. All results are stored for statistical analysis. The integrated statistic package allows a long time process control together with all necessary information for QAM-systems. Faulty IC modules are marked by a punched reject hole.