CME 3010/D

Chip Module Encapsulation

Description

After the die and wire bonding process, the chip and wires need to be protected against environmental stress. Therefore, a glob top resin is dispensed to cover these sensitive parts.

The fully automatic Encapsulation Systems CME 3010/D automate the encapsulation process with unbeaten precision and quality. Twelve modules are processed in parallel by a flexible changeable 12-fold dispensing head. Process parameters are fully programmable which make adaptation to any glob-top geometry simple and easy. Pressures are easily adjustable.

Depending on glob top material, thermal and/or UV (LED) curing systems can be integrated into the in-line Curing oven CO 1600/TUV.

The system is designed as a reel-to-reel system with automatic spooling systems for standard and super 35 mm tapes.

For quality inspection an "extension module" TI 2260 can be equipped as in-line solution in order to control the encapsulation thickness and quality. Bad units will be rejected to guarantee 100 % good output quality.