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Die sorting

Complete solution for sorting of dies from wafer into carrier

 
 
Mühlbauer supplies a complete solution for sorting dies, which are 100% optically controlled by a vision system, from wafer into a carrier, like waffle pack, gel pack, surf or carrier tapes. Bad dice remain onto the wafer or will automatically be sorted out by a suction system.
 

With our experience since 1986, Mühlbauer is one of the most professional suppliers of flexible solutions for the semiconductor backend market.

 

We understand that sorting of silicon dice and electric devices is the last step in a long production process and know of this importance. Therefore highest quality is our standard. Mühlbauer's die sorting systems are fully equipped with the precise flip chip technology as well as vision inspection of die front- and backside.

 

By our own in-house quality assurance and development department, e.g. for vision systems, as well as our own carrier tape production we have the necessary background to generate intelligent tailor-made solutions. 

 

We have solutions from small to high volume production based on a wide range of capabilities. Just contact us.

 
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Last modified:10/28/2009
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