DS VARIATION is an innovation that leads you to the new applications in the Semiconductor world - a platform solution providing highest quality control on the chips to be handled as well as possibilities for placing them onto the package as needed. This ultra flexible machine picks up chips from the wafer - the flip or non-flip mode can be chosen by simply pushing a software button. The die handling process is equipped with all the leading edge features coming from Mühlbauer’s long term experience in die sorting production. The chips are placed into the carrier - such as carrier tape, wafflepack/ Gel Pak, Jedec trays, film frames, glass tools, lead frame or other defined carriers - with high speed, 100% quality control in each process step including 6-side inspection possibilities with ultra high resolution inspection, flexibility in realizing placement of dies into different packages. DS VARIATION offers the perfect solution to your needs in chip packaging with both benefits in high volume multi-bin sorting as well as the capability to cover a whole range of niche applications. Just select your suitable output configuration.