Highest flexibility for HF & UHF to cover all inlay and strap formats

Handling of all types of chips and antennas

Proven assembly process (ACP/NCP), easy to be transferred to high volume production machines

Die handling and process based on proven high volume machines

Low investment for entering the RFID-world

All tested material combinations and process parameters (bonding forces, temperatures, curing times etc.) are evaluated and optimized and can be easily transferred to high volume chip attach solutions